Description

Forte

It is a material that is not susceptible to suffering a reduction in weight or cracks due to plasma exposure.
As it has excellent non-stickiness, it can also be used with movable parts without any problems.
It has a low metal content, thereby reducing any particle-related problems.

Application

Of semiconductor & LCD manufacturing equipment, the sealed parts that are exposed to the plasma environment
Parts that have problems in terms of lifespan and particles with FKM.
Parts for which the cost and performance are too great with FFKM.

Corresponding equipment
BLAZER O-ring-FC: plasma CVD equipment

Plasma resistance (weight reduction rate)

Assessment conditions
Equipment: surface wave plasma etching equipment
Test sample shape: AS568B-214
Gas type: O2 (2000 SCCM) + CF4 (40 SCCM)
Pressure: 133 Pa
Output: 2000 W
Exposure duration: 2.0 hrs
Elongation rate: 5%

Plasma resistance (crack resistance)

Assessment conditions
Equipment: surface wave plasma etching equipment
Test sample shape: AS568B-214
Gas type: O2 (2000 SCCM) + CF4 (40 SCCM)
Pressure: 133 Pa
Output: 2000 W
Exposure duration: 2.0 hrs
Elongation rate: 5%
Appearance observation: up to 20 minutes with 5-minute intervals and then up to 120 minutes with 10-minute intervals

Other

• TOMBO is a registered trademark or trademark of NICHIAS Corporation.
• Name of products with “®” are registered trademarks of NICHIAS Corporation.
• Name of products with “™” are trademarks of NICHIAS Corporation.